Significantly reduces board size and component count while maintaining high system efficiency and reliability for the cloud infrastructure
ON Semiconductor has launched the FDMF8811, the industry’s first 100 V Bridge Power Stage module for half-bridge and full-bridge isolated dc-dc converters. The 25 A-rated device integrates a 120 V driver IC, a bootstrap diode, and two highly efficient power MOSFETs in a PQFN-36 package.
The FDMF8811 reduces the board area required for dc-dc converter designs by approximately one third compared to discrete implementations, enabling engineers to design smaller systems. If space is not a concern, the FDMF8811 also enables increased power delivery within the existing available board area. The FDMF8811 is particularly useful in cloud applications such as wireless base stations, power modules or any on-board, isolated DC-DC converter, and industrial applications such as motor drives, fans and HVAC.
By integrating all of the key power components, ON Semiconductor has optimized the design with regards to driver and MOSFET dynamic performance, system parasitic inductance and power MOSFET RDS(ON), thereby maintaining the highest possible efficiency. The FDMF8811 delivers system efficiencies in excess of 97% in full-bridge 600 W applications.
“The FDMF8811 opens a new product category in the market,” commented Roberto Guerrero, Senior Director of Marketing, Cloud Power Solutions at ON Semiconductor. “It enables higher levels of power density in isolated dc-dc converters in the cloud infrastructure.”
“The growth in cloud-based services is explosive and continues to accelerate, creating both need and opportunity for innovation in the power management arena” said Tom Truman, Vice President and General Manager of the Cloud Power Solutions Business Unit. ”ON Semiconductor is uniquely positioned to address the entire ecosystem around the cloud, from smart phones to personal computers to datacenter infrastructure. We are committed to this space, and are investing across the breadth our portfolio to address customer pain points with innovative solutions.”
Packaging and Pricing:
The FDMF8811 is available now in clip bond PQFN-36 packaging and priced at $3.50 per unit in 10,000 unit quantities. Please contact ON Semiconductor sales representative to request samples.
A demonstration of the FDMF8811 will be available at ON Semiconductor’s booth (#1001) at the 2017 APEC, March 26 – 30 in Tampa, Florida.